this is information on a product in full production. august 2013 docid023680 rev 2 1/10 ESDAXLC6-1BT2 single-line bidirectional esd prot ection for high speed interface datasheet - production data figure 1. functional diagram (top view) features ? bidirectional device ? multiple esd strike sustainability ? extra low diode capacitance: 0.4 pf ? low leakage current ? thin sod882 package - 0402 size compatible ? ultra small: 0.6 mm 2 ? rohs compliant complies with the following standards: ? iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) applications where transient overvoltage protection in esd sensitive equipment is required, such as: ? smartphones, mobile phone and accessories ? tablets, netbooks and notebooks ? portable multimedia players and accessories ? digital cameras and camcorders ? communication systems description the ESDAXLC6-1BT2 is a bidirectional single line tvs diode designed to protect the data lines or other i/o ports against esd transients. the device is ideal for applications where both reduced line capacitance and board space saving are required. sod882t ESDAXLC6-1BT2 pin1 www.st.com
characteristics ESDAXLC6-1BT2 2/10 docid023680 rev 2 1 characteristics note: for a surge grea ter than the maximum values, th e diode will fail in short-circuit figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage: iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 16 25 kv p pp peak pulse power (8/20 s) 40 w i pp peak pulse current (8/20 s) 1.3 a t j operating junction temperature range - 40 to +150 c t stg storage temperature range - 65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c table 2. electrical characteristics (values, t amb = 25 c) symbol test condition min. typ. max. unit v br i r = 1 ma 6 v i rm v rm = 3 v 70 na v cl i pp = 1 a, 8/20 a 17 v c line f = (200 mhz- 3000 mhz), v r = 0 v 0.4 0.5 pf symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = peak pulse current c = parasite capacitance r br rm rm rm pp d = dynamic impedance t = voltage temperature coefficient
docid023680 rev 2 3/10 ESDAXLC6-1BT2 characteristics 10 figure 7. attenuation versus frequency figure 3. leakage current versus junction temperature (typical values) figure 4. junction capacitance versus applied voltage (typical values) i r (na) 0.01 0.1 1 10 25 50 75 100 125 150 t j (c) c (pf) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 012345 v r (v) figure 5. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 6. esd response to iec 61000-4-2 (-8 kv contact discharge) 50 v/div 15 v 4 v : peak clamping voltage cl v :clamping voltage at 30 ns cl v :clamping voltage at 60 ns cl v :clamping voltage at 100 ns cl 1 2 3 4 156 v 1 36 v 2 30 v 3 2 20 ns/div 20 ns/div 50 v/div v : peak clamping voltage cl v :clamping voltage at 30 ns cl v :clamping voltage at 60 ns cl v :clamping voltage at 100 ns cl 1 2 3 4 -18 v 4 -159 v 1 -25 v -36 v 3 2 100.0m 300.0m 1.0g 3.0g 10.0g 30.0g -7.00 -6.00 -5.00 -4.00 -3.00 -2.00 -1.00 0.00 s21(db) db f(hz) esda -1bxlc6- t2
package information ESDAXLC6-1BT2 4/10 docid023680 rev 2 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. sod882 thin dimension definitions table 3. sod882 thin dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.30 0.40 0.012 0.016 a1 0.00 0.05 0.000 0.002 b1 0.45 0.50 0.55 0.018 0.020 0.022 b2 0.45 0.50 0.55 0.018 0.020 0.022 d 0.55 0.60 0.65 0.022 0.024 0.026 e 0.95 1.00 1.05 0.037 0.039 0.041 e 0.60 0.65 0.70 0.024 0.026 0.028 l1 0.20 0.25 0.30 0.008 0.010 0.012 l2 0.20 0.25 0.30 0.008 0.010 0.012 pin # 1 id e d a1 a l1 e l2 b2 b1
docid023680 rev 2 5/10 ESDAXLC6-1BT2 package information 10 figure 9. footprint dimension in mm (inches) figure 10. marking note: product marking may be rotated by multiples of 180 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 11. tape and reel specifications 0.55 (0.022) 0.40 (0.016) 0.50 0.020 0.55 (0.022) pin2 pin 1 t bar indicates pin1 user direction of unreeling all dimensions are in mm 4.0 0.1 4.0 0.1 2.0 0.05 8.0 + 0.3 / - 0.1 1.75 0.1 3.5 0.05 ? 1.50 0.1 0.47 0.5 0.70 0.5 0.20 0.2 1.15 0.5 st xxz yw w t st xxz yw w t st xxz yw w t st xxz yw w t st xxz yw w t st xxz yw w t
recommendation on pcb assembly ESDAXLC6-1BT2 6/10 docid023680 rev 2 3 recommendation on pcb assembly 3.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 12. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for central exposed pad: opening to footprint ratio is 50%. c) stencil opening for leads: opening to footprint ratio is 90%. figure 13. recommended stencil window position l t w aspect ratio w t ----- 1,5 ? = aspect area lw ? 2t l w + ?? --------------------------- - 0,66 ? = lead footprint on pcb stencil window position lead footprint on pcb package footprint 0.45 mm 0.39 mm 0.05 mm 0.05 mm stencil window position 0.055 mm
docid023680 rev 2 7/10 ESDAXLC6-1BT2 recommendation on pcb assembly 10 3.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particle s: powder particle size 20-45 m. 3.3 placement 1. manual positioning is not recommended. 2. it is recommended to use th e lead recognition ca pabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of th e pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 3.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
recommendation on pcb assembly ESDAXLC6-1BT2 8/10 docid023680 rev 2 3.5 reflow profile figure 14. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. maximum soldering profile corresponds to the latest ipc/jedec j-std-020. 250 0 50 100 150 200 240 210 180 150 120 906030 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
docid023680 rev 2 9/10 ESDAXLC6-1BT2 ordering information 10 4 ordering information figure 15. ordering information scheme 5 revision history table 4. ordering information order code marking package weight base qty delivery mode ESDAXLC6-1BT2 t (1) 1. the marking can be rotated by multiples of 180 to differentiate assembly location sod882t 0.8 mg 12000 tape and reel esda xlc 6 - 1b t2 esda array extra low capacitance package t2 = thin sod882 (sod882t) breakdown voltage direction 6 = 6 v min b = bidirectional table 5. document revision history date revision changes 04-sep-2012 1 initial release. 12-aug-2013 2 updated figure 4 , figure 5 , figure 6 , figure 11 and table 4 .
ESDAXLC6-1BT2 10/10 docid023680 rev 2 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. if any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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